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Diamond wafering blades

(Precision Diamond Cut-Off Wheels)

These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements:

High Concentration (H/C) for general laboratory use, either low or high saw's speed.
Low concentration (L/C) for sectioning hard and brittle materials, such as ceramics, silicon, glass, minerals.

Please choose carefully. Returns of this item are subject to approval.

Updated: 27-12-2024

Code	Title	Diameter	Thickness (W x D)	Pack Size	Availability	Price
EMS50265-04	Diamond wafering blades	101.6mm	3.55 x 5.08mm	Each	0 in stock (?)	$456.00 AUD
EMS50265-05	Diamond wafering blades	127mm	3.55 x 5.08mm	Each	0 in stock (?)	$456.00 AUD
EMS50265-06	Diamond wafering blades	152.4mm	3.55 x 5.08mm	Each	0 in stock (?)	$553.00 AUD
EMS50265-07	Diamond wafering blades	177.8mm	6.35 x 7.01mm	Each	0 in stock (?)	$647.00 AUD
EMS50266-04	Diamond wafering blades	101.6mm	5.08 x 5.08mm	Each	0 in stock (?)	$369.00 AUD
EMS50266-05	Diamond wafering blades	127mm	5.08 x 5.08mm	Each	0 in stock (?)	$456.00 AUD
EMS50266-06	Diamond wafering blades	152.4mm	5.08 x 7.01mm	Each	0 in stock (?)	$553.00 AUD
EMS50266-07	Diamond wafering blades	177.8mm	812 x 7.01mm	Each	0 in stock (?)	$647.00 AUD
EMS50267-06	Diamond wafering blades	152.4mm	812 x 7.01mm	Each	0 in stock (?)	$553.00 AUD

* Ordering Schedule

This item is available for back-order where 0 stock is listed.
We order from this manufacturer weekly, with an estimated lead time of 4 weeks.

This is the estimated lead time, based on the average time taken previously to fill orders from this particular supplier.
Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.