Reactive ion etchers, Model RIE 2000

The Reactive Ion Etcher (RIE) is a table-top plasma chemistry reactor designed to provide anisotropic etch plasma technology at a moderate cost. This simple-to-operate instrument can perform repeatable plasma chemical reactions with a minimum of automation. All controls are manually entered into and monitored by a touch-screen interfaced control system which is equipped with automatic monitors and interlock controls to protect the equipment and the samples in the reactor. The RIE requires cooling of the stage. A simple water recirculator is typically sufficient for this task. A small water chiller option is also available for this system. Vacuum is supplied by an integrated turbo pump.Wet etching of samples is not only dangerous, in many cases it causes undercutting due to the isotropy of the etch. The Reactive Ion Etcher (RIE) uses dry etching to create an anisotropic etch - meaning that the etch is uni-directional. For laboratory applications, the typical plasma etcher h...

The Reactive Ion Etcher (RIE) is a table-top plasma chemistry reactor designed to provide anisotropic etch plasma technology at a moderate cost. This simple-to-operate instrument can perform repeatable plasma chemical reactions with a minimum of automation. All controls are manually entered into and monitored by a touch-screen interfaced control system which is equipped with automatic monitors and interlock controls to protect the equipment and the samples in the reactor. The RIE requires cooling of the stage. A simple water recirculator is typically sufficient for this task. A small water chiller option is also available for this system. Vacuum is supplied by an integrated turbo pump.

Wet etching of samples is not only dangerous, in many cases it causes undercutting due to the isotropy of the etch. The Reactive Ion Etcher (RIE) uses dry etching to create an anisotropic etch - meaning that the etch is uni-directional. For laboratory applications, the typical plasma etcher has a "barrel" design, or in other words, a cylindrical or barrel geometry to the reaction chamber. One feature of this design is that any point on the surface to be etched can be approached with equal probability from all directions, leading to an etch that is described as being "isotropic". For most if not many applications generally, an isotropic design is probably the design of choice. But in some instances, such as the removal of a passivization layer from an electronic device, isotropic etching always results in undercutting, and when the lines are below a certain point in width, such processing completely undercuts the lines leading to the layers literally falling off. But because for a "barrel" design, one can achieve respectable etch rates at relatively low power, the systems can be built and sold at lower prices.

Applications:

  • Final package removal
  • Glass passivation layer removal
  • Deep etching
  • Removal of contaminants

System Includes:

  • Reactive Ion Etcher
  • Quartz Chamber
  • Vacuum hose

Specifications:

Design Table top size, LED touch screen for ease of use, 
Dimensions (L x W x H) 381 x 533 x 356mm

Chamber Size 8" outside diameter x 4in high, 6" sample stage
Shielded Quartz chamber
Pump 70 1/sec Turbomolecular Pump
System Vent Independent interlocked solenoid with connection for dry nitrogen
Gas Delivery Dual gas input, manual gas and pressure control.
Works with O2, CF4, Ar and other gasses
Complete with Turbo System and controller
Gas Control Dual independent needle valves with safety interlocked solenoid
Timer Auto-termination of etch up to 99:99:59
Process timer for reproducible runs
Power User variable 0-200W; 13.56 MHz frequency, manual tune; air cooled; solid state design.
Electrical 110/240VAC, 50/60Hz

75lb

The system does include a simple water circulator. We would recommend that a small water chiller be used which will provide a reliable flow of cool water.

Also available:

EMS55321-2D - Replacement standard die, 3mm

EMS55320-05 - UC170 Chiller by Solid State Cooling Systems will give precise temperature control and respond instantly to any load changes holding to ± 0.1°C, even near ambient temperature. It is highly energy efficient, only using power as needed. This unit will fit with ease on your tabletop or inside your equipment, as it is the world's smallest air-cooled recirculating chiller.

UC170 Chiller:

Operating Range 2°C to 45°C (160W / 180W models)
10°C to 45°C (170W / 190W models)
Ambient Temperature 10°C to 40°C non-condensing
Repeatability ± 0.1°C (even near ambient)
Cooling Capacity 160W to 190W @ 20°C (20°C ambient)
Noise (at 1 meter) <63dBA
Coolant/Process Fluid Koolance (27% propylene glycol/water mix) or 27-50% ethylene glycol/water mix
Process Fluid Fittings â…›" female CPC with shut-off valve
Pump Magnetically-coupled gear pump with brushless DC motor
Tank Volume 75ml with level sensor (optional sealable cap)
Wetted Materials Al and polymers, or Cu and polymers
Size (L x W x H) 19 x 13 x 18cm
Weight 3.5kg
Power Input Universal: 100 - 240VAC, 50/60Hz, 2.8A max
Power Consumption Less than 200 Watts
Operating Voltage 13.5VDC, 15A max (universal input, laptop style power supply included)
Communications Keypad or RS232 interface
Alarms Temperature, fluid level, component or system failure (display, RS232 and dry contact)

RIE2000 product brochure

Updated: 11-10-2025
Code Type Pack Size Availability Price Updated: 11-10-2025
EMS55320-02 RIE 2000 Each 0 in stock (?) P.O.R. Quote
EMS55320-04 RIE 2000 with turbo pump Each 0 in stock (?) P.O.R. Quote
EMS55320-05 UC170 chiller Each 0 in stock (?) P.O.R. Quote
EMS55321-2D Standard die, 3mm Each 0 in stock (?) P.O.R. Quote