Epo-Tek H22 adhesive

Epo-Tek® H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.z Smooth, free-flowing, slightly thixotropic pastez High Tg allows it to be used for high temperature applications =300°C)z Contains no solvents – It is a NASA approved low outgassing epoxy.z Excellent resistance to solvents, chemicals and moisturez Extended pot life and fast curing at low temperature <100°Cz Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding.Maximum Bond Line Cure Schedules: 150°C................................................................................5 minutes 120°C..............................................................................10 minutes 100°C..............................................................................20 minutes 80°C...........
Epo-Tek® H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.
z Smooth, free-flowing, slightly thixotropic paste
z High Tg allows it to be used for high temperature applications =300°C)
z Contains no solvents – It is a NASA approved low outgassing epoxy.
z Excellent resistance to solvents, chemicals and moisture
z Extended pot life and fast curing at low temperature <100°C
z Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding.

Maximum Bond Line Cure Schedules:
150°C................................................................................5 minutes
120°C..............................................................................10 minutes
100°C..............................................................................20 minutes
80°C................................................................................45 minutes

Physical Properties:
Color: Part A – silver; Part B – amber
Consistency: Smooth, flowing paste
Viscosity (@ 100 RPM / 23°C): 12,000 – 20,000 cPs
Thixotropic Index: 2.36
Glass Transition Temp (Tg): = 100°C (Dynamic cure 20 – 200°C / ISO 25 Min;
Ramp -10 – 200°C @20°C/Min)
Coefficient of Thermal Below Tg: 39 x 10-6 in/in/°C
Expansion (CTE): Above Tg: 224 x 10-6 in/in/°C
Shore D Hardness: 80
Lap Shear Strength @ 23°C: 1,980 psi
Die Shear Strength @ 23°C: = 5 kg / 1,700 psi
Weight Loss: @200°C: 0.09%; @250°C: 0.23%;
@300°C: 1.42%
Degradation Temp (TGA): 454°C
Operating Temp: Continuous: -55°C to 250°C
Intermittent: -55°C to 350°C
Storage Modulus @ 23°C: 540, 120 psi
Ion: Cl- 175 ppm; Na+ 60 ppm
NH4 + 148 ppm; K+ 6 ppm
Particle Size: = 45 microns
Electrical Properties: Volume Resistivity @ 23°C: = 0.005 Ohm-cm
Thermal Properties
Thermal Conductivity: .94 W/mK
Code Title Pack Size Availability Price Updated: 27-05-2022
EMS12673-22 Epo-Tek H22 adhesive 29.5mL (1oz) 2 weeks $477.00 AUD