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Epo-Tek H22 adhesive
Epo-Tek H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.Maximum Bond Line Cure Schedule:150°C5 minutes120°C10 minutes100°C20 minutes80°C45 minutesEpo-Tek H22 features:Smooth, free-flowing, slightly thixotropic pasteHigh Tg allows it to be used for high temperature applications (≤300°C)Contains no solvents – It is a NASA approved low outgassing epoxyExcellent resistance to solvents, chemicals and moistureExtended pot life and fast curing at low temperature <100°CDesigned for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bondingTypical propert...
Epo-Tek H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.
Maximum Bond Line Cure Schedule:
| 150°C | 5 minutes |
| 120°C | 10 minutes |
| 100°C | 20 minutes |
| 80°C | 45 minutes |
Epo-Tek H22 features:
- Smooth, free-flowing, slightly thixotropic paste
- High Tg allows it to be used for high temperature applications (≤300°C)
- Contains no solvents – It is a NASA approved low outgassing epoxy
- Excellent resistance to solvents, chemicals and moisture
- Extended pot life and fast curing at low temperature <100°C
- Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding
Typical properties: (to be used as a guide only, not a specification).
| Physical Properties | ||
| Colour: | Part A – silver; Part B – amber | |
| Consistency: | Smooth, flowing paste | |
| Viscosity (@ 100 RPM / 23°C): | 12,000-20,000 cPs | |
| Thixotropic Index: | 2.36 | |
| Glass Transition Temp (Tg): | ≥100°C (Dynamic cure 20-200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) | |
| Coefficient of Thermal Expansion (CTE): | Below Tg: 39 x 10-6 in/in/°C Above Tg: 224 x 10-6 in/in/°C |
|
| Shore D hardness: | 80 | |
| Lap Shear Strength @ 23°C: | 1,980 psi | |
| Die Shear Strength @ 23°C: | ≥5 kg / 1,700 psi | |
| Degradation Temp (TGA): | 454°C | |
| Weight Loss: | @ 200°C: 0.09% @ 300°C: 1.42% |
@ 250°C: 0.23% |
| Operating Temp: | Continuous: -55°C to 250°C Intermittent: -55°C to 350°C |
|
| Storage Modulus @ 23°C: | 540,120 psi | |
| Ion: | Cl- 175 ppm Na+ 60 ppm |
NH4+ 148 ppm K+ 6 ppm |
| Particle Size: | ≤45 microns | |
| Electrical Properties: | ||
| Volume Resistivity @ 23°C: | ≤0.005 Ohm-cm | |
| Thermal Properties | ||
| Thermal Conductivity: | 0.94 W/mK | |
Please choose carefully. Returns of this item are subject to approval.
| Code | Title | Pack Size | Availability | Price | Updated: 15-09-2024 | |
|---|---|---|---|---|---|---|
| EMS12673-22 | Epo-Tek H22 adhesive | 29.5ml (1oz) | See above | $554.00 AUD | ||
