Epo-Tek H20S adhesive

Epo-Tek H20S is a modified version of EpoTekH20E. Epo-Tek H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek H20S is extremely simple to use. Epo-Tek H20S pot life is 2.5 days and shelf life is one year when store at room temperature. Maximum Bond Line Cure Schedules: 175°C ..........................................45 seconds 150°C ............................................5 minutes 120°C ..........................................15 minutes 100°C ..........................................45 minutes 80°C ............................................90 minutes Physical Properties: Color: Part A - silver; Part B - silver Consistency: Smooth, thixotropic - 4000 cPs Viscosity (@ 100 RPM / 23°C): 1,800 - 2,800 cPs Thixotropic Index: 5 Glass Transition Temp (Tg): = 80°C (Dynamic cu...

Epo-Tek H20S is a modified version of EpoTekH20E. Epo-Tek H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek H20S is extremely simple to use. Epo-Tek H20S pot life is 2.5 days and shelf life is one year when store at room temperature. Maximum Bond Line Cure Schedules: 175°C ..........................................45 seconds 150°C ............................................5 minutes 120°C ..........................................15 minutes 100°C ..........................................45 minutes 80°C ............................................90 minutes Physical Properties: Color: Part A - silver; Part B - silver Consistency: Smooth, thixotropic - 4000 cPs Viscosity (@ 100 RPM / 23°C): 1,800 - 2,800 cPs Thixotropic Index: 5 Glass Transition Temp (Tg): = 80°C (Dynamic cure 20 - 200°C / ISO 25 Min; Ramp -10 - 200°C @20°C/Min) Coefficient of Thermal Below Tg: 31 x 10-6 in/in/°C Expansion (CTE): Above Tg: 120 x 10-6 in/in/°C Shore D Hardness: 57 Lap Shear Strength @ 23°C: 1,240 psi Die Shear Strength @ 23°C: = 5 kg / 1,700 psi Weight Loss: @200°C: 0.40%; @250°C: 0.60%; @300°C: 1.37% Degradation Temp (TGA): 414°C Operating Temp: Continuous: -55°C to 200°C Intermittent: -55°C to 300°C Storage Modulus @ 23°C: 339, 720 psi Ion: Cl- 162 ppm; Na+ 0 ppm NH4 + 282 ppm Particle Size: = 20 microns Electrical Properties: Volume Resistivity @ 23°C: = 0.0005 Ohm-cm Thermal Properties: Thermal Conductivity: 3.25 W/mK

Code Title Pack Size Availability Price Updated: 05-03-2024
EMS12672-20S Epo-Tek H20S adhesive 29.5ml (1oz) 2 weeks $583.00 AUD