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Epo-Tek H20S adhesive
Epo-Tek H20S is a modified version of Epo-Tek H20E. Epo-Tek H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek H20S is extremely simple to use. Epo-Tek H20S pot life is 2.5 days and shelf life is one year when store at room temperature.Maximum Bond Line Cure Schedule:175°C45 seconds150°C5 minutes120°C15 minutes100°C45 minutes80°C90 minutesTypical properties: (to be used as a guide only, not a specification)Physical PropertiesColour:Part A: silver; Part B: silverCo...
Epo-Tek H20S is a modified version of Epo-Tek H20E. Epo-Tek H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek H20S is extremely simple to use. Epo-Tek H20S pot life is 2.5 days and shelf life is one year when store at room temperature.
Maximum Bond Line Cure Schedule:
175°C | 45 seconds |
150°C | 5 minutes |
120°C | 15 minutes |
100°C | 45 minutes |
80°C | 90 minutes |
Typical properties: (to be used as a guide only, not a specification)
Physical Properties | ||
Colour: | Part A: silver; Part B: silver | |
Consistency: | Smooth, thixotropic paste | |
Viscosity (@ 100 RPM / 23°C): | 1,800-2,800 cPs | |
Thixotropic Index: | 5 | |
Glass Transition Temp (Tg): | ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) | |
Coefficient of Thermal Expansion (CTE): | Below Tg: 31 x 10-6 in/in/°C Above Tg: 120 x 10-6 in/in/°C |
|
Shore D hardness: | 57 | |
Lap Shear Strength @ 23°C: | 1,240 psi | |
Die Shear Strength @ 23°C: | ≥5 kg / 1,700 psi | |
Degradation Temp (TGA): | 414°C | |
Weight Loss: | @ 200°C: 0.40% @ 300°C: 1.37% |
@ 250°C: 0.60% |
Operating Temp: | Continuous: -55°C to 200°C Intermittent: -55°C to 300°C |
|
Storage Modulus @ 23°C: | 339,720 psi | |
Ion: | Cl- 162 ppm Na+ 0 ppm |
NH4+ 282 ppm K+ 4 ppm |
Particle Size: | ≤20 microns | |
Electrical Properties: | ||
Volume Resistivity @ 23°C: | ≤0.0005 Ohm-cm | |
Thermal Properties | ||
Thermal Conductivity: | 3.25 W/mK |
Please choose carefully. Returns of this item are subject to approval.
Code | Title | Pack Size | Availability | Price | Updated: 20-09-2024 | |
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EMS12672-20S | Epo-Tek H20S adhesive | 29.5ml (1oz) | See above | $583.00 AUD | ||