Epo-Tek H20E adhesive (DG)

EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system for chip/electronic bonding in microelectronic and optoelectronic as well as SEM mounting applications. Used extensively for themal management applications due to its high thermal conductivity.EPO-TEK H20E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400?C)Extremly reliable conductive adhesive choice for new and old applicationsH20E contains no solvents and will not outgasWhen cured, H20E is resistant to solvents, resin and moistureLong Pot life (2? days)Shelf life is one year when store at 23?CMaximum Bond Line Cure Schedule:175?C45 seconds150?C5 minutes120?C15 minutes80?C3 hours

EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system for chip/electronic bonding in microelectronic and optoelectronic as well as SEM mounting applications. Used extensively for themal management applications due to its high thermal conductivity.

  • EPO-TEK H20E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400?C)
  • Extremly reliable conductive adhesive choice for new and old applications
  • H20E contains no solvents and will not outgas
  • When cured, H20E is resistant to solvents, resin and moisture
  • Long Pot life (2? days)
  • Shelf life is one year when store at 23?C

Maximum Bond Line Cure Schedule:

175?C 45 seconds
150?C 5 minutes
120?C 15 minutes
80?C 3 hours

Typical properties:

(To be used as a guide only, not as a specification. Data below is NOT guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150?C/1 hour; *denotes test on lot acceptance basis)

Physical Properties

*Color: Part A: silver; Part B: silver
*Consistency: Smooth, thixotropic paste
*Viscosity (@ 100 RPM / 23?C): 2,200-3,200 cPs
Thixotropic Index: 4.63
Glass Transition Temp (Tg): ?80?C (Dynamic cure 20 - 200?C / ISO 25 Min; Ramp -10 to 200?C @ 20?C/Min)
Coefficient of Thermal Expansion (CTE): Below Tg: 31 x 10-6 in/in/?C
Above Tg: 158 x 10-6 in/in/?C
Shore D hardness:  75
Lap Shear Strength @ 23?C: 1,475 psi
Die Shear Strength @ 23?C: >10 kg / 3,400 psi
Degradation Temp (TGA): 425?C
Weight Loss:

@ 200?C: 0.59%
@ 250?C: 1.09%
@ 300?C: 1.67%

Operating Temp: Continuous: -55?C to 200?C
Intermittent: -55?C to 300?C
Storage Modulus @ 23?C: 808,700 psi
Ions: Cl- 73 ppm
Na+ 2 ppm
NH4+ 98 ppm
K+ 3 ppm
*Particle Size: ?45 microns

Electrical Properties

*Volume Resistivity @ 23?C: ?0.0004 Ohm-cm

Thermal Properties

Thermal Conductivity: 2.5 W/mK, Based on standard method: Laser Flash
  29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1
Thermal Resistance: (Junction to Case): TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK H20E (2 mils thick)
EPO-TEKH20E: 6.7 to 7.0?C/W
Solder: 4.0 to 5.0?C/W


Technical Data Sheet

Safety Data Sheet - Part A 

Safety Data Sheet - Part B 


Code Title Pack Size Availability Price Updated: 06-03-2024
EMS12671-20E Epo-Tek H20E adhesive (DG) 29.5ml (1oz) See above $698.00 AUD