Wafer cleaving kit

The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. This kit is suitable for a wide variety of substrates and wafers (Si, GaAs, glass). 

The standard configuration includes one each:

• Diamond Scribe-Pen style
• Diamond Scribe-straight tip
• Diamond Scribe- 30 degree tip
• Tweezers with black soft fibre fine tip (length 6¼")
• CleanBreak Pliers-Cleaving pliers.
• Clear plastic ruler with metric and US units
• Tungsten cleaving wire

Optional Cleaving Kit with Mat:

• Includes a large, 12x18" wafer mat

Note: Always remember to use safety glasses when cleaving the wafer.