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Wafer cleaving kit
The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. This kit is suitable for a wide variety of substrates and wafers (Si, GaAs, glass). The standard configuration includes one each:
- Diamond Scribe-Pen style
- Diamond Scribe-straight tip
- Diamond Scribe- 30 degree tip
- Tweezers with black soft fibre fine tip (length 6¼")
- CleanBreak Pliers-Cleaving pliers.
- Clear plastic ruler with metric and US units
- Tungsten cleaving wire
Optional Cleaving Kit with Mat
The kit includes a large, 12x18" wafer mat.
Note: Always remember to use safety glasses when cleaving the wafer.
* Ordering Schedule
This item is available for back-order where 0 stock is listed.
We order from this manufacturer weekly, with an estimated lead time of 4 weeks.
This is the estimated lead time, based on the average time taken previously to fill orders from this particular supplier.
Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.