Diamond paste syringes

Glennel diamond products are specially formulated to help you prepare surfaces that are usually difficult to polish and require precision finish. To satisfy today's demand the diamond compounds must be complex with near perfect tolerances as is ours.

Diamond Paste

Glennel UB Formulation is excellent for most applications where a diamond compound is desired. It is soluble in either water or oil and works with all common extenders. UB compound is recommended for polishing laboratory specimens and lapping of materials such as carbide, ceramic, sapphire, composites, ferrite, and silicon.

Glennel UC Formulation is an oil soluble compound recommended for finishing wire dies, molds, cold heading dies, and general shop applications where diamond compounds are required. UC provides fast cutting action and superior finish. Meant to be used with our Formula C extender for maximum efficiency.

Glennel OS Formulation is an oil soluble compound designed for lapping large areas of hard material. Use alone or with an extender it cleans up easily, provides aggressive stock removal and an outstanding finish.

Types of Diamond:

We use three basic types of diamonds: natural monocrystalline, synthetic monocrystalline, and synthetic polycrystalline. Typical sizes range from 1/10?m to 60?m.

MONOCRYSTALLINE diamonds provide a cost effective means for good stock removal and finish. The natural form has a blocky shape with a smooth surface. Synthetic diamonds have a slightly irregular shape with multiple edges. Precision grading and high quality standards guarantee consistent shape and size. This consistency and unique shape make this a popular diamond for many production-lapping applications.

POLYCRYSTALLINE diamonds are recommended for microscopy, materialography, and where surface finish is extremely critical. We use the highest quality polycrystalline diamonds. It has a uniform blocky shape with a rough surface. Precision microfractures built into each particle provide uniform and consistent fracturing under stress.