Epo-Tek H22 adhesive

Epo-Tek H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature. z Smooth, free-flowing, slightly thixotropic paste z High Tg allows it to be used for high temperature applications =300°C) z Contains no solvents - It is a NASA approved low outgassing epoxy. z Excellent resistance to solvents, chemicals and moisture z Extended pot life and fast curing at low temperature <100°C z Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding. Maximum Bond Line Cure Schedules: 150°C................................................................................5 minutes 120°C..............................................................................10 minutes 100°C..............................................................................20 minutes 80°C................................................................................45 minutes Physical Properties: Color: Part A - silver; Part B - amber Consistency: Smooth, flowing paste Viscosity (@ 100 RPM / 23°C): 12,000 - 20,000 cPs Thixotropic Index: 2.36 Glass Transition Temp (Tg): = 100°C (Dynamic cure 20 - 200°C / ISO 25 Min; Ramp -10 - 200°C @20°C/Min) Coefficient of Thermal Below Tg: 39 x 10-6 in/in/°C Expansion (CTE): Above Tg: 224 x 10-6 in/in/°C Shore D Hardness: 80 Lap Shear Strength @ 23°C: 1,980 psi Die Shear Strength @ 23°C: = 5 kg / 1,700 psi Weight Loss: @200°C: 0.09%; @250°C: 0.23%; @300°C: 1.42% Degradation Temp (TGA): 454°C Operating Temp: Continuous: -55°C to 250°C Intermittent: -55°C to 350°C Storage Modulus @ 23°C: 540, 120 psi Ion: Cl- 175 ppm; Na+ 60 ppm NH4 + 148 ppm; K+ 6 ppm Particle Size: = 45 microns Electrical Properties: Volume Resistivity @ 23°C: = 0.005 Ohm-cm Thermal Properties Thermal Conductivity: .94 W/mK