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Epo-Tek H20E adhesive (DG)
EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system for chip/electronic bonding in microelectronic and optoelectronic as well as SEM mounting applications. Used extensively for themal management applications due to its high thermal conductivity.EPO-TEK H20E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400?C)Extremly reliable conductive adhesive choice for new and old applicationsH20E contains no solvents and will not outgasWhen cured, H20E is resistant to solvents, resin and moistureLong Pot life (2? days)Shelf life is one year when store at 23?CMaximum Bond Line Cure Schedule:175?C45 seconds150?C5 minutes120?C15 minutes80?C3 hours
EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system for chip/electronic bonding in microelectronic and optoelectronic as well as SEM mounting applications. Used extensively for themal management applications due to its high thermal conductivity.
- EPO-TEK H20E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400?C)
- Extremly reliable conductive adhesive choice for new and old applications
- H20E contains no solvents and will not outgas
- When cured, H20E is resistant to solvents, resin and moisture
- Long Pot life (2? days)
- Shelf life is one year when store at 23?C
Maximum Bond Line Cure Schedule:
| 175?C | 45 seconds |
| 150?C | 5 minutes |
| 120?C | 15 minutes |
| 80?C | 3 hours |
Typical properties:
(To be used as a guide only, not as a specification. Data below is NOT guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150?C/1 hour; *denotes test on lot acceptance basis)
Physical Properties | ||
| *Color: | Part A: silver; Part B: silver | |
| *Consistency: | Smooth, thixotropic paste | |
| *Viscosity (@ 100 RPM / 23?C): | 2,200-3,200 cPs | |
| Thixotropic Index: | 4.63 | |
| Glass Transition Temp (Tg): | ?80?C (Dynamic cure 20 - 200?C / ISO 25 Min; Ramp -10 to 200?C @ 20?C/Min) | |
| Coefficient of Thermal Expansion (CTE): | Below Tg: 31 x 10-6 in/in/?C Above Tg: 158 x 10-6 in/in/?C |
|
| Shore D hardness:Â | 75 | |
| Lap Shear Strength @ 23?C: | 1,475 psi | |
| Die Shear Strength @ 23?C: | >10 kg / 3,400 psi | |
| Degradation Temp (TGA): | 425?C | |
| Weight Loss: | @ 200?C: 0.59% |
|
| Operating Temp: | Continuous: -55?C to 200?C Intermittent: -55?C to 300?C |
|
| Storage Modulus @ 23?C: | 808,700 psi | |
| Ions: | Cl- 73 ppm Na+ 2 ppm |
NH4+ 98 ppm K+ 3 ppm |
| *Particle Size: | ?45 microns | |
Electrical Properties | ||
| *Volume Resistivity @ 23?C: | ?0.0004 Ohm-cm | |
Thermal Properties | ||
| Thermal Conductivity: | 2.5 W/mK, Based on standard method: Laser Flash | |
| Â | 29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1 | |
| Thermal Resistance: (Junction to Case): | TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK H20E (2 mils thick) EPO-TEKH20E: 6.7 to 7.0?C/W Solder: 4.0 to 5.0?C/W |
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This product is listed as dangerous goods for the purposes of shipping. Road transport only. Please do not order express shipping, as this will only result in a delay to your order.
Ordering schedule: April, August, November.
We order from this manufacturer at the beginning of these months, for delivery to our warehouse after 4-6 weeks.
Please choose carefully. Returns of this item are subject to approval.
| Code | Title | Pack Size | Availability | Price | Updated: 08-05-2024 | |
|---|---|---|---|---|---|---|
| EMS12671-20E | Epo-Tek H20E adhesive (DG) | 29.5ml (1oz) | See above | $599.00 AUD | ||
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