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Epo-Tek H20E adhesive (DG)
EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system for chip/electronic bonding in microelectronic and optoelectronic as well as SEM mounting applications. Used extensively for themal management applications due to its high thermal conductivity.
- EPO-TEK H20E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400?C)
- Extremly reliable conductive adhesive choice for new and old applications
- H20E contains no solvents and will not outgas
- When cured, H20E is resistant to solvents, resin and moisture
- Long Pot life (2? days)
- Shelf life is one year when store at 23?C
Maximum Bond Line Cure Schedule:
175?C | 45 seconds |
150?C | 5 minutes |
120?C | 15 minutes |
80?C | 3 hours |
Typical properties:
(To be used as a guide only, not as a specification. Data below is NOT guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150?C/1 hour; *denotes test on lot acceptance basis)
Physical Properties | ||
*Color: | Part A: silver; Part B: silver | |
*Consistency: | Smooth, thixotropic paste | |
*Viscosity (@ 100 RPM / 23?C): | 2,200-3,200 cPs | |
Thixotropic Index: | 4.63 | |
Glass Transition Temp (Tg): | ?80?C (Dynamic cure 20 - 200?C / ISO 25 Min; Ramp -10 to 200?C @ 20?C/Min) | |
Coefficient of Thermal Expansion (CTE): | Below Tg: 31 x 10-6 in/in/?C Above Tg: 158 x 10-6 in/in/?C |
|
Shore D hardness: | 75 | |
Lap Shear Strength @ 23?C: | 1,475 psi | |
Die Shear Strength @ 23?C: | >10 kg / 3,400 psi | |
Degradation Temp (TGA): | 425?C | |
Weight Loss: | @ 200?C: 0.59% |
|
Operating Temp: | Continuous: -55?C to 200?C Intermittent: -55?C to 300?C |
|
Storage Modulus @ 23?C: | 808,700 psi | |
Ions: | Cl- 73 ppm Na+ 2 ppm |
NH4+ 98 ppm K+ 3 ppm |
*Particle Size: | ?45 microns | |
Electrical Properties | ||
*Volume Resistivity @ 23?C: | ?0.0004 Ohm-cm | |
Thermal Properties | ||
Thermal Conductivity: | 2.5 W/mK, Based on standard method: Laser Flash | |
29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1 | ||
Thermal Resistance: (Junction to Case): | TO-18 package with nickel-gold metallised 20 x 20 mil chips and bonded with EPO-TEK H20E (2 mils thick) EPO-TEKH20E: 6.7 to 7.0?C/W Solder: 4.0 to 5.0?C/W |
Ordering schedule: April, August, November.
We order from this manufacturer at the beginning of these months, for delivery to our warehouse after 4-6 weeks.
Code | Title | Pack Size | Availability | Price | Updated: 05-11-2024 |
---|---|---|---|---|---|
EMS12671-20E | Epo-Tek H20E adhesive (DG) | 29.5ml (1oz) | 0 in stock (?) | $576.00 AUD |
* Ordering Schedule
This item is available for back-order where 0 stock is listed. Ordering schedule: April, August, November.
We order from this manufacturer at the beginning of these months for delivery to our warehouse after 4-6 weeks.