Epo-Tek H22 adhesive
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Epo-Tek H22 adhesive

Epo-Tek H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.Maximum Bond Line Cure Schedule:

Epo-Tek H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.

Maximum Bond Line Cure Schedule:

150°C 5 minutes
120°C 10 minutes
100°C 20 minutes
80°C 45 minutes

Epo-Tek H22 features:

  • Smooth, free-flowing, slightly thixotropic paste
  • High Tg allows it to be used for high temperature applications (≤300°C)
  • Contains no solvents – It is a NASA approved low outgassing epoxy
  • Excellent resistance to solvents, chemicals and moisture
  • Extended pot life and fast curing at low temperature <100°C
  • Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding

Typical properties: (to be used as a guide only, not a specification).

Physical Properties
Colour: Part A – silver; Part B – amber
Consistency: Smooth, flowing paste
Viscosity (@ 100 RPM / 23°C): 12,000-20,000 cPs
Thixotropic Index: 2.36
Glass Transition Temp (Tg): ≥100°C (Dynamic cure 20-200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min)
Coefficient of Thermal Expansion (CTE): Below Tg: 39 x 10-6 in/in/°C
Above Tg: 224 x 10-6 in/in/°C
Shore D hardness: 80
Lap Shear Strength @ 23°C: 1,980 psi
Die Shear Strength @ 23°C: ≥5 kg / 1,700 psi
Degradation Temp (TGA): 454°C
Weight Loss: @ 200°C: 0.09%
@ 300°C: 1.42%		 @ 250°C: 0.23%
Operating Temp: Continuous: -55°C to 250°C
Intermittent: -55°C to 350°C
Storage Modulus @ 23°C: 540,120 psi
Ion: Cl- 175 ppm
Na+ 60 ppm		 NH4+ 148 ppm
K+ 6 ppm
Particle Size: ≤45 microns
Electrical Properties:
Volume Resistivity @ 23°C: ≤0.005 Ohm-cm
Thermal Properties
Thermal Conductivity: 0.94 W/mK

Part A MSDS 

Part B MSDS

Updated: 03-01-2025
Code Title Pack Size Availability Price Updated: 03-01-2025
EMS12673-22 Epo-Tek H22 adhesive 29.5ml (1oz) 0 in stock (?) $462.00 AUD