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Product Code: EMS6760.1

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Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation. ULTRA TEC has produced leading solutions for backside preparation since 1999. With over 300 ASAP-1 units installed in Semiconductor industry labs throughout the world, we are proud to introduce the ASAP-1® IPS.

Enabling The Next Generation Of Failure Analysis

Ever since the inception of the ASAP-1 Project, ULTRA TEC's goal has been to offer both user-friendly and sample-friendly tools. The ASAP-1® analog systems offer elegant, intuitive controls which have enabled all labs to achieve quality results for subsequent analysis with Photon emission microscopes, laser/ thermal stimulus microscopes and FIB's. The user-friendly intutive nature of the analog units has been carried forward, and expanded with ASAP-1® IPS.

Product Highlights

  • Suits all sizes of die – package, wafer and board-level
  • Real Time Video Monitor with system parameter
  • Touchscreen control with physical joystick & controls
  • Rigidized Table Assembly and closed-loop, high-torque, motor control enhances the machining of tough and hard materials
  • X, Y and Z axes all have deep sub-micron accuracy
  • Accurately decaps, then thins substrate and polishes
  • Patented Floating Head provides a true polishing action – yields polishing quality & high survivability
  • Intuitive menus provide a powerful, easy to use, system
  • USB Flash Driveinterface for preparation recipe storage
  • Short set-up and process times
  • Accurate die-tilt adjustment 'on the fly'
  • Bench-top & Quiet in Operation

ASAP-1® IPS offers deep sub-micron control on X, Y and Z axes, making it 'hands-down' the most accurate system ever seen in the market.

ASAP-1® IPS enhances the marketleading attributes of our legacy products with the latest digital technology. It is now possible to grind substrates thinner, polish flatter and de-process even more accurately. ASAP-1® IPS introduces a suite of features that automate many aspects of the process – from analyzing the part to be processed, to writing intuitive programmable recipes, to reading in-situ end-stop indicators that ensure each important sample is prepared correctly. The patented 'float down' polishing head design is retained, and enhanced with the use of force feedback. to achieve the quality of final polish demanded by customers for backside microscopy, Laser scan, FIB and SIL.

The dedicated machine-vision monitor provides an 'always on' realtime view of the part, overlaid with current system coordinates and parameter. Now you can see the part as it is being processed

A touchscreen interface, a physical joystick and encoders – alongside a suite of intuitive software and hardware features — empowers the FA technician & engineering professional for the next generation of failure analysis.

Specifications

Z-Vertical Direction Precision 0.04 microns (40 nanometers)
Table Precision (X& Y Travel) 0.2 microns (200 nanometers)
Table Travel Amplitude 100mm x 100mm
Polishing Method Patented ASAP-1 Float-down head, with Z-lock, enhanced with electronic sensors and tool patterns
Video Real-time machine vision with 6.5 inch video monitor. External Video Output (NTSC)
Programming Input Method Touchscreen with joystick and 3 physical rotary encoders
Machine Vision Real-time Video of overlaid with stage and process variables
Tilt Control Computer-aided 2-circle tilt control, ULTRACOLLIMATOR Measurement (option)
Force Control 1000grams (max) with 1 gram precision. Overall accuracy ± 10 grams
Recipe Load & Save USB Port, for removable flash drive (up to 2Gb) Z Position Touch-off Method Mechanical Positioning with Force-feedback (option) sensors
X & Y Position LASER Targeting
Power Consumption 300 Watts Maximum in use
Power Requirements Universal: 100-120VAC; 200-240VAC
Footprint 19 inches (480mm) Width x 25 inches (635 mm) Depth x 22 inches (560mm) Height
Weight-25Kg 

Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation. ULTRA TEC has produced leading solutions for backside preparation since 1999. With over 300 ASAP-1 units installed in Semiconductor industry labs throughout the world, we are proud to introduce the ASAP-1® IPS.

Enabling The Next Generation Of Failure Analysis

Ever since the inception of the ASAP-1 Project, ULTRA TEC's goal has been to offer both user-friendly and sample-friendly tools. The ASAP-1® analog systems offer elegant, intuitive controls which have enabled all labs to achieve quality results for subsequent analysis with Photon emission microscopes, laser/ thermal stimulus microscopes and FIB's. The user-friendly intutive nature of the analog units has been carried forward, and expanded with ASAP-1® IPS.

Product Highlights

  • Suits all sizes of die – package, wafer and board-level
  • Real Time Video Monitor with system parameter
  • Touchscreen control with physical joystick & controls
  • Rigidized Table Assembly and closed-loop, high-torque, motor control enhances the machining of tough and hard materials
  • X, Y and Z axes all have deep sub-micron accuracy
  • Accurately decaps, then thins substrate and polishes
  • Patented Floating Head provides a true polishing action – yields polishing quality & high survivability
  • Intuitive menus provide a powerful, easy to use, system
  • USB Flash Driveinterface for preparation recipe storage
  • Short set-up and process times
  • Accurate die-tilt adjustment 'on the fly'
  • Bench-top & Quiet in Operation

ASAP-1® IPS offers deep sub-micron control on X, Y and Z axes, making it 'hands-down' the most accurate system ever seen in the market.

ASAP-1® IPS enhances the marketleading attributes of our legacy products with the latest digital technology. It is now possible to grind substrates thinner, polish flatter and de-process even more accurately. ASAP-1® IPS introduces a suite of features that automate many aspects of the process – from analyzing the part to be processed, to writing intuitive programmable recipes, to reading in-situ end-stop indicators that ensure each important sample is prepared correctly. The patented 'float down' polishing head design is retained, and enhanced with the use of force feedback. to achieve the quality of final polish demanded by customers for backside microscopy, Laser scan, FIB and SIL.

The dedicated machine-vision monitor provides an 'always on' realtime view of the part, overlaid with current system coordinates and parameter. Now you can see the part as it is being processed

A touchscreen interface, a physical joystick and encoders – alongside a suite of intuitive software and hardware features — empowers the FA technician & engineering professional for the next generation of failure analysis.

Specifications

Z-Vertical Direction Precision 0.04 microns (40 nanometers)
Table Precision (X& Y Travel) 0.2 microns (200 nanometers)
Table Travel Amplitude 100mm x 100mm
Polishing Method Patented ASAP-1 Float-down head, with Z-lock, enhanced with electronic sensors and tool patterns
Video Real-time machine vision with 6.5 inch video monitor. External Video Output (NTSC)
Programming Input Method Touchscreen with joystick and 3 physical rotary encoders
Machine Vision Real-time Video of overlaid with stage and process variables
Tilt Control Computer-aided 2-circle tilt control, ULTRACOLLIMATOR Measurement (option)
Force Control 1000grams (max) with 1 gram precision. Overall accuracy ± 10 grams
Recipe Load & Save USB Port, for removable flash drive (up to 2Gb) Z Position Touch-off Method Mechanical Positioning with Force-feedback (option) sensors
X & Y Position LASER Targeting
Power Consumption 300 Watts Maximum in use
Power Requirements Universal: 100-120VAC; 200-240VAC
Footprint 19 inches (480mm) Width x 25 inches (635 mm) Depth x 22 inches (560mm) Height
Weight-25Kg 

Shipping

Orders with items in stock are packed within 24 hours. We ship with our best choice of courier, depending on goods ordered and shipping address provided.

Location

Standard delivery

Express delivery

Townsville/Local

Next day

N/A

Queensland

2-3 business days

N/A

NSW

4-10 business days

2-3 business days

SA/Tas/Vic/WA

6-14 business days

2-3 business days

Overseas

N/A

5-14 business days

*Note: Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers' control.

Standard shipping is $15 in Australia (free on orders over $200). Add $5 to ship Express (under 2kg only)

Pickup

Order online and collect from our warehouse in Townsville.

Location

Freight Charge

Ready for collection

11 Carlton Street, Kirwan

$0

Once invoice has been emailed
(Less than 1 business day)



Shipping

Orders with items in stock are packed within 24 hours. We ship with our best choice of courier, depending on goods ordered and shipping address provided.

Location

Standard delivery

Express delivery

Townsville/Local

Next day

N/A

Queensland

2-3 business days

N/A

NSW

4-10 business days

2-3 business days

SA/Tas/Vic/WA

6-14 business days

2-3 business days

Overseas

N/A

5-14 business days

*Note: Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers' control.

Standard shipping is $15 in Australia (free on orders over $200). Add $5 to ship Express (under 2kg only)

Pickup

Order online and collect from our warehouse in Townsville.

Location

Freight Charge

Ready for collection

11 Carlton Street, Kirwan

$0

Once invoice has been emailed
(Less than 1 business day)



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