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Prices are current as of Saturday, 28/11/2020.
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Product Code: EMS3250.1

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ULTRAPOL Advance was developed to work as an all-in-one lapping & polishing workstation for flat surface development. Advance's unbeatable mix of advanced features and process technologies allows new IC generations to be processed accurately. 

Key technological applications include:

  • Topside electronic de-processing – enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR
  • Backside preparation of packages and wafers, particularly for flip-chips – and rapid global thinning of larger surfaces
  • Cross-sectioning of die and package-level devices

Along with its signature quick release interface and work holder technologies, ULTRAPOL advance offers completely new designs for sample loading, oscillation and tilt alignment.

Fast and convenient sample movement between polisher & microscope, coupled with the option of the ULTRACOLLIMATOR optical alignment system, provides reference to the die -- a huge improvement over earlier generation polishers.

The system allows recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a 'Power Polish' mode is incorporated that rotates the sample during processing.

  ULTRAPOL  ULTRAPOL  ULTRAPOL  ULTRAPOL  ULTRAPOL  ULTRAPOL  ULTRAPOL

 Product Highlights

  • Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis provide for optical alignment that does not wander.
  • Slurry polishing – A recirculating pump may be added, in addition to the standard coolant system. Slurries are held within a drip tray for easy disposal, or re-use.
  • Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning of all items that come into contact with abrasives and polishing media
  • Better delayering results – The ULTRACOLLIMATOR option allows for improved parallelism, improving the 'sweet spot' of the delayered surface

The use of optical alignment allows for simpler faster and significantly more accurate alignment to be achieved on a range of sample types and applications including: Crystal polishing, Double side wafer polishing, Topside de-processing of layers of metal circuitry for electronic failure analysis and competitive analyses, Backside polishing of packaged computer dice for 'through silicon' microscopy.

ULTRAPOL Advance Polishing System includes: Base unit with timer, oscillator, speed control (50 to 400rpm), 8" (200mm) Polishing plate Sample Z-direction control with 1µm precision Mechanical alignment indicator 2 circle tilt control (+/- 2 degrees) Sample Rotation control Quick release interface mounting system 2 sample mounting plates and start-up accessory kit sample load control - 0 to 3 kg (in 50 gram increments) Drip Tray / Slurry Containment Tray.

Our upgraded patented ULTRACOLLIMATOR technology allows for fast accurate and repeatable parallel alignment of surfaces to the polisher. Since the collimator beam optically aligns directly to the die, there is no guesswork or the need to use mechanical indicators. Alignment is constantly monitored during polishing. Transfer to-and-from the microscope is made fast and accurate. Any small realignments can be made quickly and accurately.

ULTRACOLLIMATOR modules allow the user to produce the finest results of sample parallelism with both flat lapping and selected area preparation machines. The units produce a 'single box' solution, incorporating an LCD screen and all the controls required to align the sample.

ULTRAPOL Advance was developed to work as an all-in-one lapping & polishing workstation for flat surface development. Advance's unbeatable mix of advanced features and process technologies allows new IC generations to be processed accurately. 

Key technological applications include:

  • Topside electronic de-processing – enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR
  • Backside preparation of packages and wafers, particularly for flip-chips – and rapid global thinning of larger surfaces
  • Cross-sectioning of die and package-level devices

Along with its signature quick release interface and work holder technologies, ULTRAPOL advance offers completely new designs for sample loading, oscillation and tilt alignment.

Fast and convenient sample movement between polisher & microscope, coupled with the option of the ULTRACOLLIMATOR optical alignment system, provides reference to the die -- a huge improvement over earlier generation polishers.

The system allows recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a 'Power Polish' mode is incorporated that rotates the sample during processing.

  ULTRAPOL  ULTRAPOL  ULTRAPOL  ULTRAPOL  ULTRAPOL  ULTRAPOL  ULTRAPOL

 Product Highlights

  • Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis provide for optical alignment that does not wander.
  • Slurry polishing – A recirculating pump may be added, in addition to the standard coolant system. Slurries are held within a drip tray for easy disposal, or re-use.
  • Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning of all items that come into contact with abrasives and polishing media
  • Better delayering results – The ULTRACOLLIMATOR option allows for improved parallelism, improving the 'sweet spot' of the delayered surface

The use of optical alignment allows for simpler faster and significantly more accurate alignment to be achieved on a range of sample types and applications including: Crystal polishing, Double side wafer polishing, Topside de-processing of layers of metal circuitry for electronic failure analysis and competitive analyses, Backside polishing of packaged computer dice for 'through silicon' microscopy.

ULTRAPOL Advance Polishing System includes: Base unit with timer, oscillator, speed control (50 to 400rpm), 8" (200mm) Polishing plate Sample Z-direction control with 1µm precision Mechanical alignment indicator 2 circle tilt control (+/- 2 degrees) Sample Rotation control Quick release interface mounting system 2 sample mounting plates and start-up accessory kit sample load control - 0 to 3 kg (in 50 gram increments) Drip Tray / Slurry Containment Tray.

Our upgraded patented ULTRACOLLIMATOR technology allows for fast accurate and repeatable parallel alignment of surfaces to the polisher. Since the collimator beam optically aligns directly to the die, there is no guesswork or the need to use mechanical indicators. Alignment is constantly monitored during polishing. Transfer to-and-from the microscope is made fast and accurate. Any small realignments can be made quickly and accurately.

ULTRACOLLIMATOR modules allow the user to produce the finest results of sample parallelism with both flat lapping and selected area preparation machines. The units produce a 'single box' solution, incorporating an LCD screen and all the controls required to align the sample.

Shipping

Orders with items in stock are packed within 24 hours. We ship with our best choice of courier, depending on goods ordered and shipping address provided.

Location

Standard delivery

Express delivery

Townsville/Local

Next day

N/A

Queensland

2-3 business days

N/A

NSW

4-10 business days

2-3 business days

SA/Tas/Vic/WA

6-14 business days

2-3 business days

Overseas

N/A

5-14 business days

*Note: Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers' control.

Standard shipping is $15 in Australia (free on orders over $200). Add $5 to ship Express (under 2kg only)

Pickup

Order online and collect from our warehouse in Townsville.

Location

Freight Charge

Ready for collection

11 Carlton Street, Kirwan

$0

Once invoice has been emailed
(Less than 1 business day)



Shipping

Orders with items in stock are packed within 24 hours. We ship with our best choice of courier, depending on goods ordered and shipping address provided.

Location

Standard delivery

Express delivery

Townsville/Local

Next day

N/A

Queensland

2-3 business days

N/A

NSW

4-10 business days

2-3 business days

SA/Tas/Vic/WA

6-14 business days

2-3 business days

Overseas

N/A

5-14 business days

*Note: Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers' control.

Standard shipping is $15 in Australia (free on orders over $200). Add $5 to ship Express (under 2kg only)

Pickup

Order online and collect from our warehouse in Townsville.

Location

Freight Charge

Ready for collection

11 Carlton Street, Kirwan

$0

Once invoice has been emailed
(Less than 1 business day)



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